VNCHIP
Manufacturing Design
We provide:
Production Management
Package Design
Failure Analysis
Reliability Testing
Production Management
Package
Design
Failure
Analysis
Reliability
Testing
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Design for Manufacturing
Production Management
VNCHIP maintains close communication with partners during wafer fabrication, packaging, and testing, ensuring seamless coordination in technology, timelines, quality, and materials management. Our targeted support at every stage ensures that the designed produces consistently meet the highest standards of performance and quality throughout the manufacturing process.
We provide:
- PPA-Based Foundry and Process Evaluation and Selection
- Chip Architecture and Circuit Evaluation And Review
- Target Yield, Reliability, Cost Structure Proposal and Evaluation
- WAT and Corner Lot Review
- Manufacture Process and Cost Optimization
Design for Manufacturing
Package Design
VNCHIP’s expertise supports complex packaging design. As chip designs evolve, we provide tailored solutions that exceed performance expectations with precision and efficiency.
We provide:
- Package and Substrate Design
- Single-Chip, Multi-Chip (Let), Hybrid-Type, Wafer-Level and Heterogeneous Integration Packages
- Package on Package (POP) and System in Package (SIP) Integration
- Chip-Package-System Co-Development
- Chip and System Thermal Solution
We provide:
- Industry Partnerships and Expertise in Failure Analysis and Debugging
- One-Stop Failure Analysis Services
- Chip Circuit, Substrate, Package, and System Failure Analysis
Design for Manufacturing
Reliability Testing
VNCHIP performs stringent environmental stress tests, accelerated life testing, and electrical stress assessments to guarantee the stability and reliability of products across their entire lifecycle.
We provide:
- ESD/Latch-up/HTOL/EFR Testing Platform Design
- ESD/Latch-Up Circuit Preview
- HTOL/EFR Operation and Test Report
- ESD HBM/MM/CDM and Latch-Up Test Plan
- Post-Test Failure Analyses for ESD/Latch-Up/Reliability Tests