VNCHIP

Design for Testing

We provide:

Testability Design

Testability Design

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Result Analysis and Summary

Result Analysis and Summary

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System Level Testing

System Level Testing

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Design for Testing

Testability and Manufacturability

VNCHIP systematically employs structured and automated testing, refining DFT plans and enhancing fault coverage. This approach identifies blind spots and design flaws early, ensuring products meet the highest standards in mass production.

PKG
UBI
Mark
VMI
CP
FTH
FTC
SLT
FG











  • Die Temp. @25°C
  • Fault Coverage Test
  • MFG ID
  • Die Temp. @90°C
  • Fault Coverage Test
  • FTH_minV
  • Max Power
  • Guard Band(GB)
  • PLL Calibration
  • Speed Binning
  • Per Part Database
  • Die Temp. @5°C
  • Fault Coverage Test
  • FTC_minV
  • Parallax Offset
  • P/F@FTH_minV + GB
  • Efuse
  • Product ID
  • Per Part Database
CP
PKG
FTH
UBI
FTC
Mark
SLT
VMI
FG
  • Die Temp. @25°C
  • Fault Coverage Test
  • MFG ID
  • Die Temp. @90°C
  • Fault Coverage Test
  • FTH_minV
  • Max Power
  • Guard Band(GB)
  • PLL Calibration
  • Speed Binning
  • Per Part Database
  • Die Temp. @5°C
  • Fault Coverage Test
  • FTC_minV
  • Parallax Offset
  • P/F@FTH_minV + GB
  • Efuse
  • Product ID
  • Per Part Database



We provide:

Design for Testing

Test Result Analysis

VNCHIP uses cutting-edge DFT technology to capture and analyze chip test data, finding opportunities for design improvement. This boosts yield, cuts costs, and ensures top quality.

Design for Testing

System Level Testing

VNCHIP uses advanced DFT and tailored solutions to streamline testing, optimize costs, and speed up product launch.

We provide: