VNCHIP
Design for Testing
We provide:
Testability Design
Result Analysis and Summary
System Level Testing
Testability Design
Result Analysis and Summary
System Level Testing
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Design for Testing
Testability and Manufacturability
VNCHIP systematically employs structured and automated testing, refining DFT plans and enhancing fault coverage. This approach identifies blind spots and design flaws early, ensuring products meet the highest standards in mass production.
PKG
UBI
Mark
VMI
CP
FTH
FTC
SLT
FG
- Die Temp. @25°C
- Fault Coverage Test
- MFG ID
- Die Temp. @90°C
- Fault Coverage Test
- FTH_minV
- Max Power
- Guard Band(GB)
- PLL Calibration
- Speed Binning
- Per Part Database
- Die Temp. @5°C
- Fault Coverage Test
- FTC_minV
- Parallax Offset
- P/F@FTH_minV + GB
- Efuse
- Product ID
- Per Part Database
CP
PKG
FTH
UBI
FTC
Mark
SLT
VMI
FG
- Die Temp. @25°C
- Fault Coverage Test
- MFG ID
- Die Temp. @90°C
- Fault Coverage Test
- FTH_minV
- Max Power
- Guard Band(GB)
- PLL Calibration
- Speed Binning
- Per Part Database
- Die Temp. @5°C
- Fault Coverage Test
- FTC_minV
- Parallax Offset
- P/F@FTH_minV + GB
- Efuse
- Product ID
- Per Part Database
We provide:
- DFT test plan of logic ATPG & logic/memory BIST
- Stuck-at, functional, and speed fault coverage report
- Correlation analysis and report for coverage enhancement
- CP/FT Wafer test program development
- Probe card, load board, and active thermal control design
Design for Testing
System Level Testing
VNCHIP uses advanced DFT and tailored solutions to streamline testing, optimize costs, and speed up product launch.
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We provide:
- SLT Board and Thermal Control Design
- Customized SLT Software Development
- Real-Time Monitoring of Test Results and Platform Status
- SLT Data Collection and Analysis